TWI’s training activity focuses on electronic and microsystems interconnection and packaging, from a practical level to an executive overview. Typical courses would include: wire bonding, soldering, hermetic packaging, die attach, component and system reliability, design for production. This training is run as scheduled public courses, but increasingly involves tailored courses, to meet specific industry needs.

	Generic (i.e. applied to a variety of design tools)
	Specific to proprietary design tools

Number of personnel involved in training activity: 6