CIL provides custom ASIC packaging solutions utilising Multi-Chip Module (MCM) and Chip on Board (COB) technologies. A complete design and automated manufacturing service is provided from its facilities in Hampshire. Ceramic and polymer boards (pcbs) are utilise as substrates with the ASICs assembled as bare die, together with other parts not integrated on the silicon. Services offered include: substrate and PCB design, prototyping and full automated production for batch sizes from 50 off to 50,000 per month

Prime:		COB and MCM Manufacture
Subsidiary:		Consulting / Design / Training
Employees:		10-50

	PLD		FPGA		Masked ASIC
	Microcontroller		Other

Industrial, marine, medical, automotive, security

PC Based:	YES	Other:
Details: